10:30 am -12:00 pm

S1 Electrical and Thermal Design and Simulation 1

Packaging, Thermal Management, and Reliability for (Power) Electronics and Electric Machines
Sreekant Narumanchi, National Renewable Energy

A Unified Data Framework for Electro-Thermal Co-Design in Advanced 3D IC Packages
Andras Vass-Varnai, Siemens

Meeting System Requirements for High-Speed Signaling in Scalable AI Data Centers: PCB Design Challenges and Manufacturing Considerations
Rockwell Hsu, Cisco

S2 Innovations in PCB Plating and Surface Finishes

Evaluating OSP Finish Robustness Under Multiple Cleaning and Soldering Exposures Using a Multi-Variable DOE Approach
Ravi Parthasarathy, Zestron Corporation

Advancements in Solderable Finishes for 5G Applications
Denis Jacques, Technic, Inc.

Using Ionic Contamination Measurements to Assess Ionic Residues in OSP After Manufacture
Christopher Hunt, GEN3

S3 SMT Process 1: Solder Reflow Processes & Reliability

Clean Reflow Process Using Efficient Targeted Cleaning Methods
Joseph Clure, KurtzERSA Inc

Fill the Void IX: The Impact of Reflow on Voiding in Solder Joints
Tony Lentz, FCT Assembly

Formic Acid Convection Reflow Soldering for Leaded and Lead-Free Technologies
Matthew Schneider, Indium Corporation

S4 Power Package Module Assembly

Safe EV Batteries: BMS Cell Balancing with Transformer-Based Anomaly Detection to Prevent Thermal Runaway
Andrew Misiani, University of North Dakota

Accelerating Power-Cycling Test of Power Semiconductor Module with Early Cycle Data–Based Aging Trajectory Prediction
Yichi Zhang, Aalborg University

Advanced Integration Strategies for Power Electronics: Embedding SiC MOSFETs in High-Performance Power Modules
Lars Böttcher, Fraunhofer IZM Berlin

S5 Metrology Tools and Techniques 1

Exploring the Impact of Contaminants on Wetting Reduction Across Various Metalizations
Jose Servin, Schaeffler

Electrochemical Impedance Spectroscopy: A New Approach to Cleanliness Assessment
Adam Klett, KYZEN

Revolutionizing 3D metrology with Quantum MRI - Qu-MRITM
Sanjive Agarwala, Euqlid.io

2:00 pm-4:30 pm

S6 Electrical and Thermal Design and Simulation 2

Measuring small inductances using low frequency LCR-meters
Michael Obrecht, Siborg Systems Inc

PCB Impedance and Loss Control of Entire Link for 224Gbps Serdes
Lu Xiao, Shengyi Electronics

From Chaos to Clarity: Unlocking AI-Ready PCB Manufacturing with IPC-2581
Dana Korf, VGT

S7 Advanced PCBs, Substrates and Interposers

Advancing Organic Substrate Technology with Embedded Thin Film Resistors for Miniaturized Electronics
John Andresakis/Andreas Schilloff, Quantic Ohmega Ticer

FOPLP RDL Technology Based on Panel-Level eSiP
Lingling Du, Shanghai Meadville Science & Technology Co., Ltd

Extreme Low Loss Material for High Speed Application
Chieh-Sen Lee, Elite Material Co., Ltd.

Preserving Interface Integrity in IC Substrates: A Non-Etch Approach to Wedge and Sidewall Reliability
Thomas Thomas, Atotech Taiwan Limited

S8 Additive Manufacturing Processes and Assembly

High-Resolution Stereolithography-Based 3D Printing of Coaxial Interconnects
Jeroen Sol, TNO at Holst Centre

Purely Additive PCB Fabrication by Nano Cu Inkjet Printing
Keisuke Ito, Michiharu Hayashi, Elephantech Inc.

Iterative Rapid Design, Prototyping, and Evaluation of Constrained Volume 3D-Printed Fixtures for Gradient Thickness Parylene C Anti-Reflective Coatings
Sean Clancy, HZO, Inc.

Evaluation of Solder Paste Printability With Solder Paste Inspection Equipment After Extended Stencil Cleaning Cycle Intervals
Jasbir Bath, Koki Solder America Inc

S9 Quality and Reliability 1: Ionic Contamination and Temperature Humidity Bias (THB)

Investigation Into Achieving Accurate Ion Contamination Measurements and Their Correlation to Industry Specifications
Neil Patton, Atotech UK Ltd.

Redefining Temperature Humidity Bias (THB) Testing and Moisture Resistance Life Design for Printed Circuit Boards for Automotive
Takenori Kakutani, Taiyo Ink Mfg. Co., Ltd.

Use and Misuse of Ionic Contamination Measurements – 5 Years After Revision of IPC-J-STD-001, Chap. 8
Lothar Henneken, Robert Bosch GmbH

Electrical vs Electrochemical Voltage During Humidity Caused Failures in Electronics: Misconceptions and Reality
Rajan Ambat, Technical University of Denmark

S10 Interface Materials and Evaluations for CLP/SLP Integrations

Comprehensive Thermomechanical Testing Performance of High-Reliability Lead-Free Solder Alloys in BGA and Wafer-Level Packages
Kennedy Fox, MacDermid Alpha Electronics Solutions

Innovative Material Reinforcement Strategies for Advanced Packaging Solutions in Automotive Electronics
Anna Lifton, MacDermid Alpha Electronics Solutions

Cold‑Storage Survivability of Liquid‑Metal TIMs at −40°C Enabled by Supercooling
Ian Tevis, Indium Corporation

Liquid Metals as a Thermal Interface Material (TIM)
Miloš Lazić, Sunny Agarwal, Indium Corporation

Advancements in iBGA Image Sensor Encapsulation: Meeting Increasing Automotive Reliability Demands
Patrick Schirmer, DELO Industrial Adhesives

9:30 am-12:00 pm

S11 Advanced PCB Fabrication 1

Reliability Performance of Air Cavity Backed Antennas Integrated Into PCB Stack-Ups
Erich Schlaffer, AT&S

Reliability Comparison of Desmear and Positive Etchback of Via Interconnects in Printed Boards used in Military and Aerospace Products
John Bauer, Robert Cooney, Collins Aerospace

Analysis of Laser Depaneling of Substrates With PFAS-Free Coatings in Terms of Quality and Related Design Rules
Patrick Stockbrügger, LPKF Laser & Electronics SE

Super Fine Line Subtractive Process Study
Yitao He, Shanghai Meadville Science & Technology Co., Ltd.

Redefining Impedance Monitoring: Inboard Impedance Trace TDR Waveform Analysis for Next-Gen PCB Manufacturing
Kaspar Tsang, Brian Chang, Lenovo

S12 Metrology Tools and Techniques 2

Inside the Chip: Advanced CT X-Ray Imaging for Counterfeit Mitigation
David Kruidhof, ChipsID

Bridging the Gap in Assembly Post-Mold Wirebond Screening through a Capacitive-Based Test Method
Jeshurun Rojas, Keysight Technologies Sales Pte. Ltd.

Microwave dielectric testing of coatings and adhesives for advanced electronic packaging in the 5-130 GHz range
Bartlomiej Salski, Warsaw University of Technology

Meeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques
Mo Shakouri, Microsanj

S13 Quality and Reliability 2: Solder Joint Reliability / Harsh Environments

Drop Shock Test of SAC-Based Alloys at Elevated Temperature
Palash Vyas, Veoneer

Analysis of Solder Peeling Phenomenon in High-Density Packaging of Electronic Components
Yasufumi Shibata, Toyota Motor Corporation

Connecting Microstructural Damage to Electrical Performance in Lead Free Solder Joints
Dorottya Varga, Robert Bosch Ltd.

Impact of Thermal Ramp Rate on Solder Joint Reliability
Laura Cohen, Woodward

S14 Microvia, Stacked Via & Embedded Circuitry Reliability

Discrete Resistance Mapping for Detecting Out-of-Family Microvias in D-Coupons
Emily Tang, The Aerospace Corporation

Evaluation of Microvia Direct Plated Copper in Comparison to Traditional Electroless Plating
Nicole Carpentier, Scott Sitzman, The Aerospace Corporation

Stacked Microvia Manufacturing Capability Assessment for High-Reliability Applications
Maarten Cauwe, imec

A Review of Factors Effecting Crystallisation and Epitaxial Growth in Blind Micro Vias
Roger Massey, Atotech

S15 Sustainability for Electronics: Lifetime Optimization of Electronics / Materials Circularity

High-Performance Bio-Based Composite as a Sustainable Alternative to FR-4 Printed Circuit Board Laminates
Victor Verlinden, Virenti

A Framework for Circular Economy Driven Sustainable Cable Harness Design and Material Management for Harsh Environment Applications
Didem Üstün, FNSS Defense Systems

Benchmarking Agentic AI for Regulatory Substance Analysis: A Neuro-Symbolic Approach to Zero-Hallucination Compliance
Zakaria Bouachra, Banyan.eco

Sourcing Considerations for Sustainable Manufacturing
Elise Baker, MacDermid Alpha Electronics Solutions

2:00 pm-5:30 pm

S16 Next-Generation Assembly Materials for High-Power Modules

Development of a New High-Reliability Alloy with Superior Thermal-Shock Resistance
Jasbir Bath, Koki Solder America Inc.

Root Cause Analysis of Solder Joint Reliability in IMS-Based LED Modules Using Thermal Resistance Measurement and FEM
Seung won Seon, Hyundai Mobis

Compressible Metal Thermal Interface Material (TIM) for Power Electronic Module to Heat-Sink Attach
Emin Skiljan, Indium Corporation

S17 SMT Process 2: Stencil & Print Quality

Screen Printer Alignment Performance Analysis
Miguel Arroyo Colomer, Yamaha Motor Corporation, U.S.A.

Rethinking Area Ratio: A Physics-Based Model for Predicting Solder Paste Transfer Efficiency for Thin Stencils
Gayle Towell, AIM Solder

From Lab to Line: Validating Engineered Solvents in Real-World SMT Production
Ed Nauss, Debbie Carboni, ITW/EAE/MPM

S18 Factory Automation for Advanced Electronics Assembly

Data Transformation with Transformer Addons: Enabling (Standard) Interfaces for Automation and Predictive Analytics in Smart Electronic Manufacturing
Moritz Floder, Ersa GmbH

Secure Data Access and Transfer in SMT-Manufacturing Using Digital Credentials
Thomas Marktscheffel

Autonomous Optimization in AOI: AI Recipe QC for Smarter, Adaptive Defect Detection
Chai Ling Teoh, ViTrox

S19 Advancemencts in Test Methodologies

AI-Enabled Multimodal Test  & Inspection for Electronics
Navid Asadi Zanjani, University of Florida

Failure Mode Effects Testability Analysis (FMETA): Testability, Diagnosability, Prognosability from an FMEA
Louis Ungar, A.T.E. Solutions, Inc.

Automated Junction Temperature Control in High-Volume Final Test Manufacturing
Taehyung Kim, Qualcomm

S20 Advanced PCB Fabrication 2

Young's Modulus of Rolled Copper Foils Obtained from Stress-Strain Curves Measured by Digital Image Correlation
Kenji Koike, JX Advanced Metals Corporation

Research On the Slope of TDR Impedance Test of Transmission Line
Victor Qi, AKMMV

The Influence of Different Pre-Lamination Treatments on 8/8 μm Line Width/Spacing by the Semi-Additive Process
Yitao He, Shanghai Meadville Science & Technology Co., Ltd.

S21 Solders and Adhesives

Advancements in Jettable and Screen-Printable Solder Pastes: Cleaning Compatibility for Complex Semiconductor and Electronic Assemblies
Matthew Gruber, Stephen Pavlik, Kalyan Nukala, Indium Corporation

Effect of Aging on Lead-Free Solder Pastes’ Rheological Behavior
Mathilde Buret, Inventec Performance Chemicals

A Review on A Bi-free In-Containing Lower Temperature Solder
Hongwen Zhang, Indium Corporation

S22 SMT Process 3: Cleaning, Compatibility & Reliability

Glass SIR Test Board Development to Identify Harmful Flux Residues during Assembly and Cleaning Processes
Mike Bixenman, Magnalytix, LLC

Beyond Qualification: Investigating the Influence of Cleaning Bath Age on Assembly Reliability
Ram Wissel, KYZEN

Impact of Solder Paste and Conformal Coating Interactions on Electrochemical Performance in Low-Standoff Assemblies
Cole Sandvold, MacDermid Alpha Electronics Solutions

S23 AI for Visual Inspection: Imaging, Modeling and Interconnect Quality Intelligence

A Study of Scoring Methods in Performance Evaluation of Retrieval-Augmented Generation for Engineering Document Summarization
Feng Xue, IBM

How AI Can Protect and Secure the PCB Supply Chain
Guro Krossen, CONFIDEE

S24 Encapsulants, Coatings and Potting Compounds

Next Generation UV-Cure Conformal Coatings: Advancing Reliability in Harsh Environments
Beth Turner, MacDermid Alpha Electronics Solutions

LED Curable Conformal Coatings with High Protective Properties
Chris Brightwell, Humiseal Europe

Evaluating Conformal Coatings Ability To Protect During Condensation Testing
Christopher Hunt, GEN3

S25 Quality and Reliability 3: High Voltage

Ensuring PCBA Reliability: Addressing Cleanliness, Moisture Condensation, and High Voltage Challenges
Rajan Ambat, Technical University of Denmark

Driving Reliability Through Technical Cleanliness: Correlating HV Tests with Geometrical Particle Metrics
Olaf Schoenfeld, Zestron Europe

Special Session: Advanced Electronic Packaging for Aerospace & Defense Electronics 

Thursday, March 19 – 8:30 am-11:00 am 

Aerospace and defense applications place some of the most demanding constraints on electronic packaging, requiring extreme reliability while aggressively reducing size, weight and power (SWaP). This special session focuses on how advanced packaging solutions are being developed to ensure electronics can withstand harsh environments, including vibration, shock, radiation, extreme temperature swings and long mission lifetimes.

These expert presentations and panel discussion will highlight how design, materials selection and manufacturing technologies converge to meet stringent aerospace and defense qualification requirements. Attendees will gain perspective on packaging strategies that support flight-critical and mission-critical systems while enabling the next generation of miniaturized, high-performance electronics.

Panel Speakers

Luc Ouellet, Business Development Manager Packaging and Test, IBM Canada (Bromont)

Advanced Packaging Solutions to Meet Aerospace & Defense Market Requirements

Luc graduated in 1994 with a bachelor’s degree in Materials Engineering and began his career at IBM Bromont in the packaging development group. He participates in the development of new processes for assembly with organic substrates, transition from leaded to lead-free soldering and introduction of low K dielectrics which brought several challenges.  In 2005, he became a Program Manager for the introduction of new products and since 2015 has been a Business Development Manager to offer assembly and test services of the IBM plant in Bromont. 

Jason G. Milne, Senior Technical Fellow, Raytheon Technologies Corporation (RTX)

RF and 3DHI Integration for Sensors and Communications

Jason G. Milne is a Senior Technical Fellow at Raytheon Technologies Corporation (RTX) - El Segundo, CA. He is a subject matter expert in advanced microelectronics packaging technology including 3DHI, 3D, 2.5D and RF mixed-signal and photonics packaging design with over 26 years of microelectronics hardware and packaging design experience.  He is leading several ground-breaking technology development programs in advanced microelectronics packaging including DARPA NGMM, MIDAS, ELGAR, MAX and RAMP programs. He is a graduate of Harvey Mudd College and holds over 25 domestic and international patents in RF electronics, additive manufacturing, advanced packaging, thermal solutions and phased arrays.

Mark Litecky, Executive Consultant, SkyWater Technology

Building the Future of Advanced Packaging: Fan-Out Wafer Level Packaging at Scale

Mark Litecky is an executive consultant for SkyWater Technology focused special projects including corporate development, strategic relationships, and business development. Mark served as SkyWater’s Chief Revenue Officer from 2020 to 2024.  In that role his focus was building and aligning revenue generating teams to meet the needs of targeted markets, further expand SkyWater’s diversified customer relationships, and drive profitable and predictable growth for the company. 

Mark’s 30+ years of industry expertise includes building out revenue teams, sales, marketing, revenue generation, strategic partnerships, and business development. He has leadership skills in corporate strategy, organizational structure, technology development, new product roadmaps, engineering, operations, acquisitions, company integrations and IPOs. 

Mark holds a Bachelor of Science in electrical engineering from the University of Minnesota. 

Special Session: Future of EV and Autonomous Vehicle Electronics

Thursday, March 19 – 11:30 am-2:30 pm 

This special session will explore how rapid advancements in electrification, autonomy and connectivity are reshaping automotive electronic packaging requirements. As vehicles demand higher power density, improved thermal performance and uncompromising reliability, packaging materials and architectures must evolve to support wide bandgap power electronics, advanced sensor fusion for radar and LiDAR, and next-generation power and industrial modules.

Through expert presentations and a panel discussion, attendees will gain insight into innovations in packaging materials, component embedding, substrate technologies and manufacturing processes that enable reliable performance across diverse automotive operating environments—supporting the transition to autonomous, electrified and highly integrated vehicle platforms.

Panel Speakers

Rajesh Mandamparambil, NXP Semiconductors

Advanced Packaging for Radar and LiDAR: Enabling Sensor Fusion for Autonomous Driving

Rajesh Mandamparambil is a Technology Director at NXP Semiconductors in Eindhoven, where he leads package pathfinding for millimeter wave analog and mixed signal devices used in next generation automotive radar and high frequency systems. With more than two decades of experience across photonics, flexible electronics, sensor integration, and semiconductor packaging, Rajesh specializes in translating advanced research into manufacturable, high reliability automotive solutions.

He has authored over 50 scientific publications spanning photonics, optical sensing, thin film manufacturing, microfluidics, and wearable technologies. Before joining NXP, he helped establish core capabilities in Flexible Hybrid Electronics and laser based thin film processing at TNO/Holst Centre, and contributed to microfluidic and evaporation driven sensing technologies as a Visiting Scientist at Eindhoven University of Technology. Rajesh holds an Executive MBA from TIAS, The Netherlands, and a PhD in Photonics from the Cochin University of Science and Technology, India, where he pioneered research in Long Period Waveguide Gratings (LPWGs) and polymer optical fiber sensors.

Dr. Michael Jörger, Global Head of Technology, Heraeus Electronics GmbH & Co. KG 

Packaging Materials for the WBG Era: Innovations for High Performance Power Electronics

Dr. Michael Jörger has 20 years of experience in managing product development and launching of innovative materials for electronics and renewable energies with a focus of Power Modules and Semiconductor Packaging materials. Michael holds a Ph.D. in Material Science from ETH Zurich, Switzerland, and a diploma in chemistry from the University of Karlsruhe in Germany. 

Lars Boettcher, Group Manager - Embedding and Substrate Technologies, Fraunhofer IZM 

Advanced Substrates Technologies as an Enabler of Chiplet Systems

Lars Boettcher currently works at Fraunhofer IZM in Berlin, where he heads the “Embedding and Substrate Technologies” group. He has been working here for 26 years and specializes in advanced packaging. Recent projects have focused on technologies for power electronics applications based on component embedding, as well as panel-level packaging targeting ultra-fine line and pitch technologies. In 2000, Mr. Boettcher earned an engineering degree in microsystems engineering from the University of Applied Sciences (Berlin, Germany).

Mike McKweon, CTO-Americas, Hesse Mechatronics, Inc.

Trends in Packaging for Power & Industrial Modules

Mike has his Ph.D. from National University in San Diego, CA on machine learning of ultrasonic welding for cylindrical battery cells and his master’s from Beckett’s University in Leeds, United Kingdom, on large diameter aluminum wedge bumping. Mike has been involved with numerous universities, institutes and national laboratories with power modules on a global scale.

Lenora Clark, Director of Autonomous Driving and Safety Technology, MacDermid Alpha Electronics Solutions

Future Architecture of Autonomous Vehicles

Lenora Clark is the Director of Autonomous Driving and Safety Technology for MacDermid Alpha Electronics Solutions.  She leads the team in understanding all systems involved in advanced safety on the path to full autonomy.  She seeks to understand industry challenges associated to this endeavor.  Lenora works closely with fabricators, tier ones and car makers to understand the needs of the entire supply chain to achieve faster, more reliable solutions.  She works in all aspects of electronics uniting circuitry, semiconductor and assembly solutions for a holistic approach to automotive market needs especially for advanced driving assistance.    

Lenora has worked for the company for over 20 years and has been published in numerous industry technical conferences.  She holds four patents.  She graduated from the University of Connecticut with a bachelor’s degree in chemistry and received her master’s degree in chemistry.