Technology Pavilion
This new show-floor hub will showcase companies shaping the future through daily presentations exploring breakthroughs in 3D integration, thermal characterization, laser-enabled fabrication, connected design workflows, automated metrology, next-generation IPC-based design certification, advanced EDA tools, multi-physics simulation, and digital manufacturing technologies driving innovation in ultra-HDI, complex board routing, and advanced PCBAs.
Technology Pavilion Presentations Schedule:
| Tuesday, March 17 |
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11:00–11:30 AM Copper Nanoparticle Inkjet on Rigid PCBs : From Prototype to Mass Production This Year Elephantech Inc. |
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12:00–12:30 PM Reduce Risk and Improve Reliability with Connected Supply-Chain Data Elisa IndustrIQ USA, Inc dba CalcuQuote |
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1:00–1:30 PM Automated Spatial Micro-Sectioning: Advancing Metallography and Correlated Metrology Leeds Engineering and Data Science |
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2:00–2:30 PM Meeting Emerging Thermal Challenges of 3D Heterogeneously Dr. Mo. Shakouri Microsanj, LLC |
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3:00–3:30 PM Altium + Global Electronics U: A New IPC-Standard Certification Path Altium |
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4:00–4:30 PM Luminovo GmbH |
| Wednesday, March 18 |
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10:00–10:30 AM Smarter Boards, Faster Builds: PLM Strategies for Printed Circuit Board Design and Manufacturing PTC |
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11:00–11:30 AM AI Agent Swarms Building De-Risked Supply Chains in Electronics Banyan.eco |
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12:00–12:30 PM IPC-1782 Compliance Made Simple: Ledgit's Factory of the Future Traceability Septillion Technologies |
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1:00–1:30 PM Advancements in 2K Conformal Coating Christian Vega Axxon Mycronic |
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2:00–2:30 PM Design Rules for Depaneling and the Potential for Laser Technology Patrick Stockbrügger LPKF Laser & Electronics |
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3:00–3:30 PM Accelerating the Design-Thru-Manufacturing Flow and Reducing Manufacturing Costs with DFM and Design-for-Cost Analysis Oren Manor Siemens |
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3:30–5:00 PM Design Town Hall |