Advanced Electronic Packaging Conference 2027
Component-to-System-Level Integration
Hosted at APEX EXPO 2027
Conference sessions: April 5-7, 2027
Professional Development courses: April 4, 5 and 8, 2027
Posters available on the APEX EXPO show floor: April 6-8, 2027
Call for Technical Presentations, Posters & Professional Development Courses
Submit your abstract using the links below.
A Trusted Conference - Clearly Defined for Today’s Industry
The Advanced Electronic Packaging Conference (AEPC) 2027, hosted at APEX EXPO 2027, is the electronics industry’s premier technical conference for component-to-system-level integration, advanced PCB & assembly manufacturing and next-generation electronics technologies.
AEPC 2027 will once again feature peer-reviewed technical content driving the future of the global electronics ecosystem and emerging system integration technologies.
Bringing together a global community of industry leaders, technologists and researchers, AEPC 2027 will yet again serve as a collaborative forum for advancing innovation, addressing manufacturing challenges and accelerating the development and adoption of next-generation electronics technologies across the full electronics value chain.
Why Present at the Advanced Electronic Packaging Conference 2027?
Share Your Work with the Right Audience
Your presentation will reach a highly engaged global audience looking for new technologies, manufacturing solutions and practical insights they can apply within their companies and across the electronics value chain.
Be Part of the Industry’s Technical Conversation
AEPC 2027 stands at the intersection of real-world needs, emerging technologies and practical insights across various technical disciplines. Presenting puts your work alongside the innovations shaping tomorrow’s electronics manufacturing landscape.
Earn Recognition Through a Competitive, Peer-Reviewed Program
Speaking opportunities are limited and highly competitive. Selection by the Technical Program Committee reflects strong technical merit and positions you among leading contributors in the field.
Extend the Reach of Your Work
Accepted technical presentations will become part of the conference’s digital technical archive and the Global Electronics Association Knowledge Hub resources, increasing visibility and accessibility of your work to engineers and industry professionals worldwide.
Whether your work focuses on a single discipline or spans multiple areas, this conference provides a forum for sharing practical insights and advancing the state of the industry.
Topic Areas
The technical focus areas below are intended to guide submissions and reflect the scope of the conference, not to limit it.
Design & Simulation
High-speed, RF/mmWave, optical and thermal simulation; Chip-Package-PCB codesign for chiplets and system integration; AI-optimized design
Materials
Substrates and interposers, adhesives, TIMs, coatings, sustainable materials, next-generation solder alloys
PCB Fabrication & Advanced Processes
SAP/mSAP, substrate-like PCBs (SLPs), hybrid stack-ups, microvias, drilling, plating, additive/printed electronics processes
Assembly, Test & Manufacturing
Fine-pitch assembly engineering and manufacturing, advanced package to board-level assembly test and reliability, integration of electronic and optical components, embedded components assembly & test, high-voltage, power module assembly, automated inspection tools and techniques
Quality, Reliability & Metrology
Harsh environments, lifecycle modeling, intermetallics, embedded components reliability, high-voltage applications, ionic contamination
Digital Manufacturing
AI, Digital Twin, predictive analytics, smart factory integration, cybersecurity, factory automation
Sustainability
Circular materials, Scope 1 & 2 reporting automation, design for lifetime optimization
No late abstracts will be accepted for the conference.
Technical Presentations Important Dates
- Abstracts due — September 18, 2026
Technical presentations are delivered as conference presentations. Final presentation materials are subject to Technical Program Committee review and approval and may be archived and made available through the Global Electronics Association Knowledge Hub and other conference-related educational resources.
Technical Presentations submission portal
Technical Posters Important Dates
- Abstracts due — December 4, 2026
Accepted posters are displayed on the show floor and presented during the conference poster session. Accepted poster materials may be archived and made available through the Global Electronics Association Knowledge Hub and other conference-related educational resources.
Professional Development Courses
The Association also seeks proposals for professional development courses to be offered during the conference.
Provide an abstract that summarizes the topic(s) to be covered in the course, intended target audience, learning objectives, number of three-hour sessions necessary for the topic and any preferred prior knowledge needed for success in the course.
Honoraria and travel expense stipends are offered to professional development instructors, but instructors are responsible for making their own travel and hotel reservations.
Professional Development Courses Important Dates
- Abstracts due — September 18, 2026
Questions
For more information about participating in the Advanced Electronic Packaging Conference 2027 as an author/presenter or professional development course instructor, please contact the Global Electronic Association’s Conference and Events Manager, Julia Flynn, by email at juliaflynn@electronics.org